Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders
El-Daly, AA; Hammad, AE; Gamila Al-Sayed Al-Ganainy; Ragab, M;
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| Title | Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders | Authors | El-Daly, AA; Hammad, AE; Gamila Al-Sayed Al-Ganainy ; Ragab, M | Issue Date | 2014 | Journal | Materials Science and Engineering A | Volume | 608 | Start page | 130 | End page | 138 |
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