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| Issue Date | Title | Author(s) |
| 2019 | Comparison study of Sn and Bi addition on microstructure and bio-degradation rate of as-cast Mg-4wt% Zn alloy without and with Ca-P coating | Moussa, ME; Mohamed, HI; Waly, MA; Ahmed, AB; Talaat, MS; Gamila Al-Sayed Al-Ganainy |
| 2002 | Creep Characteristics of a New Pb-Free Soldering Sn–In Pewter | Gamila Al-Sayed Al-Ganainy |
| 2014 | Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5 Zn alloy | El-Daly, AA; Hammad, AE; Ibrahiem, AA; Gamila Al-Sayed Al-Ganainy |
| 2017 | Effect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt% Zn–3 wt% In solder alloy | El-Daly, AA; Fawzy, A; Gamila Al-Sayed Al-Ganainy ; Hussein, N |
| 2017 | Effect of adding Sb on microstructure, mechanical properties and in vitro degradation behavior of as cast Mg-4wt% Zn alloy for medical application | Mohamed, Hadeer I; Moussa, Mohamed E; Waly, Mohamed A; Ahmed, Aya B; Talaat, Mona S; Gamila Al-Sayed Al-Ganainy |
| 2003 | Effect of heat treatment on the work-hardening parameters of a new Pb-free solder Sn–9.8 wt% In alloy | Gamila Al-Sayed Al-Ganainy |
| 1996 | Effect of Phase Transformation on Creep Characteristics of Sn—5 wt% Bi Alloy | Khalifa, BA; Afify, R; Nagy, MR; Gamila Al-Sayed Al-Ganainy |
| 2001 | Effect of Structural Transformation on the Creep Parameters of Sn–9.8 wt% In Alloy | Gamila Al-Sayed Al-Ganainy |
| 1998 | Effect of Temperature and Stress on the Structure and Creep Parameters of Pb—2 at% Sb Alloy | Al-Ganainy, GS; Mostafa, MT; Nagy, MR; Gamila Al-Sayed Al-Ganainy |
| 2000 | Grain size dependence of steady state creep rate in Sn–1 wt% Zn alloy | Mostafa, MT; Gamila Al-Sayed Al-Ganainy |
| 2011 | Influence of heat treatment on stress–strain behaviour and lattice parameters of Sn–In alloy | Abd El-Khalek, AM; Sakr, MS; Gamila Al-Sayed Al-Ganainy |
| 2014 | Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders | El-Daly, AA; Hammad, AE; Gamila Al-Sayed Al-Ganainy ; Ragab, M |
| 2006 | Microstructure Changes and Steady State Creep Characteristics in the Superplastic Sn-5wt.% Bi alloy During Transition. | Khalifa, BA; Nagy, MR; Afify, R; Gamila Al-Sayed Al-Ganainy |
| 2003 | New multicomponent solder alloys of low melting pointfor low-cost commercial electronic assembly | Sakr, MS; Gamila Al-Sayed Al-Ganainy |
| 2014 | Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn | El-Daly, AA; Hammad, AE; Al-Ganainy, GS; Ragab, MJJoA; Gamila Al-Sayed Al-Ganainy |
| 2004 | Quenching media and temperature dependence of structural and stress–strain characteristics of deformed Pb-2 at% Sb alloy during transformation | Mostafa, MT; Abd El-Salam, F; Gamila Al-Sayed Al-Ganainy |
| 2003 | Steady-state creep and creep recovery during transformation in Al–Zn alloys | Abd El-Khalek, AM; Nada, RH; Gamila Al-Sayed Al-Ganainy ; Mostafa, MM |
| 2014 | Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0 Ag–0.5 Cu lead-free solder alloy | El-Daly, AA; Fawzy, A; Younis, MJ; Gamila Al-Sayed Al-Ganainy |
| 1998 | Study of steady state creep and lattice parameters of Sn–1 wt% Zn pewter near the transition temperature | Gamila Al-Sayed Al-Ganainy |
| 2004 | Transient Creep and Creep Recovery Behaviour of Cu-2wt% Sn Alloy Near the Transformation Temperature | Gamila Al-Sayed Al-Ganainy ; Mostafa, MM |
